Design parameters | ||
|---|---|---|
Min. | 8х8 mm | |
Dimensions | Max. One and two sided | 450х570 mm |
Max. Multilayer (up to 20 layers) | 400х500 mm | |
Min. | 0,1 mm | |
material thickness | Max. | 3.0 mm |
Inner layers thickness | Min. | 200µm |
Marking print | Min. | microns |
Aspect ratio | 1:3 (5) | |
Via | final diameter | 300µm |
annular ring | 250µm | |
Conductor width | Min. | 150µm |
Conductor / pad – via | Min. | 150µm |
Conductor / pad – milling edge min. | Min. | 250µm |
Conductor / pad – scoring edge min. | Min. | 400µm |
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